Volume 5, Issue 2 (spring 2008 2008)                   IJMSE 2008, 5(2): 1-7 | Back to browse issues page

XML Print

Download citation:
BibTeX | RIS | EndNote | Medlars | ProCite | Reference Manager | RefWorks
Send citation to:
N. Hatami,, R. Babaei, P. Davami. MODELING SURFACE TENSION AND WALL ADHESION IN MOLD FILLING PROCESS. IJMSE 2008; 5 (2) :1-7
URL: http://ijmse.iust.ac.ir/article-1-131-en.html
MODELING SURFACE TENSION AND WALL ADHESION IN MOLD FILLING PROCESS
N. Hatami, , R. Babaei , P. Davami
Abstract:   (30004 Views)
Abstract: In this study an algorithm for mold-filling simulation with consideration of surface tension has been developed based on a SOLA VOF scheme. As the governing equations, the Navier-Stokes equations for incompressible and laminar flows were used. We proposed a way of considering surface tension in mold-filling simulation. The proposed scheme for surface tension was based on the continuum surface force (CSF) model we could confirm the remarkable effectiveness of the surface tension by experiment which concluded in very positive outcome.
Keywords: Simulation, Surface Tension, SOLA-VOF.
Full-Text [PDF 215 kb]   (6806 Downloads)    
Type of Study: Research Paper |
Add your comments about this article : Your username or Email:
CAPTCHA
Send email to the article author

Rights and permissions
Creative Commons License This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

© 2022 All Rights Reserved | Iranian Journal of Materials Science and Engineering

Designed & Developed by : Yektaweb